Highest quality standards are achieved through the implementations of latest technology, decades of experience and everlasting moral values , which have helped us to retain our customers as well as multiply them.
Enabling technology for direct metal deposition on molding resin: Booster® MR is a unique wet-chemical adhesion enhancement process for primer-less metal plating directly on molding resins. Direct plating on molding resin enables applications for conformal electromagnetic interference (EMI) shielding and “direct circuit formation” on molding resins, such as for FO WLP (FO PoP, FO SiP). The Booster® MR process can handle singulated and strip based products, using tape carriers to prevent the I/O side from being attacked by the plating solutions.
* To embrace new technologies and methods. * To give unsurpassed products and services to the clients. * To constantly look for improvement and changes.